Tungsten Copper Sheet/Wcu Alloy Sheet / Heat Sinks of Electronic Packaging /Tungsten Copper Composite (WCu)
Model No.: W60Cu40, W70Cu30, W75Cu25, W80Cu20
Product Brief IntroductionW-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience. The thermal expansion can be adjusted to match with the following material: Ceramic materials: , (A-90,A-95,A-99), BeO (B-95, B-99), AIN, etc; Semiconductor materials: Si, GaAs, SiGe, SiC, GaP; Metal Material: Kovar alloy(4J29), 42 alloy; The quality of our composite is the leader in China, contributed with our strict quality control measures. Our porosity is very low; our surface/volume ratio(measured with BET) is only 50% of similar products of 100 pieces of 5*5*2 mm W80-Cu20 composite). Our products have high hermeticity and can pass the He mass-spectrometer leak test ( Contact us if you need more details on Wcu Sheet. We are ready to answer your questions on packaging, logistics, certification or any other aspects about Copper Tungsten Sheet、Heat Sink Sheet. If these products fail to match your need, please contact us and we would like to provide relevant information.
Product Categories : Heat Sinks Of Electronic Packing
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