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Home > Products > Heat Sinks Of Electronic Packing > Mobdenum Copper Sheet- Mocu-CMC-CPC-Molybdenum Copper Rod

Mobdenum Copper Sheet- Mocu-CMC-CPC-Molybdenum Copper Rod

Basic Info

Model No.:  KD007

Product Description

Model NO.: KD007 Material: Compound Semiconductor Package: BGA Application: Temperature Measurement Trademark: ZZKD Origin: Zhuzhou Manufacturing Technology: Optoelectronic Semiconductor Type: Intrinsic Semiconductor Signal Processing: Analog Digital Composite and Function Surface: Machined Transport Package: Plywood Box Product Brief Introduction
Mo-Cu composites is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
 Product Properties Physical Properties of Major Products
Material Wt%
Molybdenum
Content
Wt%
Copper Content
g/
Density at 20ºC
W/M.K
Thermal conductivity at 25ºC
(/k)
Coefficient of thermal expansion at 20ºC
Mo85Cu15 851 Balance 10 160-180 6.8
Mo80Cu20 801 Balance 9.9 170-190 7.7
Mo70Cu30 701 Balance 9.8 180-200 9.1
Mo60Cu40 601 Balance 9.66 210-250 10.3
Mo50Cu50 500.2 Balance 9.54 230-270 11.5
 Cu/Mo70Cu/Cu (CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of thickness in Cu: Mo: Cu is 1:4:1. it has different CTE in X and Y direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.
 Features of Cu/Mo70Cu/Cu Large sized sheets available ( length up to XXmm, width up to XXmm) More easily to be stamped into components than CMC Very strong interface bonding which can repeatedly resist 850ºC heat shock Higher thermal conductivity and lower cost  Product Properties
Material g/
Density at 20ºC
(10-6/k)
Coefficient of thermal expansion at 20ºC
W/M.K
Thermal conductivity at 25ºC
In-plane Thru-thickness In-plane Thru-thickness
1:4:1 9.4 7.2 9.0 340 300
Typical Application: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount.
Mobdenum Copper Sheet- Mocu-CMC-CPC-Molybdenum Copper Rod
 

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Product Categories : Heat Sinks Of Electronic Packing

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